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DI Fluid Water Heaters for Semiconductor Manufacturing Process
Model | PWH-24i | PWH-48i | PWH-72i | PWH-96i | PWH-144i |
Heating method | Radiation heating with near infrared rays | ||||
Heater wattage | 24kW | 48kW | 72kW | 96kW | 144kW |
Standardflowrat(e at55°C) | 6l/min | 12l/min | 18l/min | 24l/min | 36l/min |
Minimum heating flow rate | 2l/min | 5l/min | 10l/min | ||
Temperature setting range | 25 to 85°C | ||||
Temperature control accuracy | ±1°C ※1 | ||||
Flow meter indication range | 0 to 10l/min | 0to50l/min(. Nottheguaranteedrangeoftemperaturecontrolaccuracy) | |||
Allowable DI-Water pressure | 0.4MP(a Reliefpressure:0.35MPa) | ||||
Heater | Halogen lamp. Indirect heating without direct contact with water | ||||
Heating vessels material | High-purity transparent quartz | ||||
Wetted materials of the piping | Fluorocarbon polymer | ||||
Safety functions | Flow rate error, overheating, no liquid operation, leakage sensor disconnection and lamp disconnection Power off, alarm, error indication or signal output in case of error detection | ||||
External communication function | RS-232C/RS-48(5 option)※2 | ||||
External input/output function | 8-input/14-outputsigna(l Variesdependingonspecification) | ||||
Overalldimension(s mm)※3 | W340×D850×H1384 | W340×D850×H1384 | W340×D850×H1584 | W340×D850×H1986 | W1050×D700×H2004 |
Weight | Approx. 140kg | Approx. 150kg | Approx. 160kg | Approx. 210kg | Approx. 410kg |
Powerrequiremen(t 50/60Hz) | AC200/208V 69/67A | AC200/208V 139/133A | AC200/208V 208/200A | AC200/208V 277/266A | AC200/208V 416/400A |
A hot water supply system for ultra-pure water that is ideally suited for point-of-use for rinsing of silicon wafers and glass substrates of liquid crystal displays.
DI-Water Heater heats purified water used to rinse silicon wafers in the manufacture of semiconductor and glass substrates in the manufacture of LCDs. The halogen lamps are housed in transparent, double-waIled high-purity quartz glass tubes to ensure efficient and contaminant free heating of ultral-pure water. The slim, compact design minimizes foot point for installation at the point of use.
● Features
1. Clean
Heating vessels through which water-flows and all plumbing pipes are respectively made of high-purity quartz glass and fluorocarbon polymer.
2. Compact
Slim and compact unit requires minimal foot print for installation at the point of use.
3.ExceIIent temperature control
High power of halogen lamps quickly raise the temperature and adjust it in response to variations in the water flow rate.
4.High Efficiency
Efficiency with than 95%.
5. Safety
Optimum operational safety is provided through displays and sound alarms against abnormal conditions such as overheating, uncharged heating, excessive pressure and leakage of water.
● Applications
1. Heating of ultra-pure water for rinsing of silicon wafers and glass substrates of LCDs.
2.Heating of pure water used in place of CFC for cleaning.